ASML and Major Chipmakers Partner to Develop 12-Inch Photomasks for High-NA EUV Machines
5 sources across 5 countries
Who reported this
- Frankfurter Allgemeine
- NRC
- The Korea Herald
- Focus Taiwan
- Reuters
What the colours mean
- Left
- Centre-left
- Centre
- Centre-right
- Right
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ASML is collaborating with a coalition of chip manufacturers, including TSMC, Samsung, and Intel, to transition the industry to larger 12-inch extreme ultraviolet (EUV) lithography photomasks. This initiative aims to upgrade the production capabilities of ASML's most advanced High-NA EUV machines to better support the manufacturing of complex AI chips. The current industry standard uses 6-inch photomasks, but the shift to 12-inch versions is expected to improve wafer fab productivity, reduce manufacturing costs, and eliminate the need to stitch together two smaller masks during the exposure process. TSMC plans to introduce High-NA technology into mass production starting in 2030, while Samsung has indicated a target of 2028. The partnership intends to establish a pilot production line for the 12-inch masks by 2031, with a goal of volume manufacturing by 2033.
The High-NA EUV machines are significantly more expensive than previous generations, with unit prices reported to be well over 350 million euros. While Intel has already installed one of these machines, other giants like TSMC had previously hesitated due to concerns over the productivity gains relative to the high cost. ASML is currently the sole manufacturer of these commercial EUV lithography machines. In addition to the technical partnership, ASML has begun construction on a new campus in Eindhoven to support its expansion. The move toward larger masks is seen as a necessary step for the industry to push the limits of device miniaturization and meet the growing demand for faster, more energy-efficient chips driven by artificial intelligence.
How each side framed it
- Centre
- These reports focused on the technical necessity of the upgrade and the collaborative nature of the semiconductor ecosystem.
- Centre-right
- These reports emphasized the high financial costs of the machinery and the strategic competitive advantages for the companies involved.
Sources
- Centre Focus Taiwan: TSMC, ASML partner on 12-inch EUV photomasks for advanced chips
- Centre-right Frankfurter Allgemeine: 350 million euro unit price: ASML wins TSMC for its most modern chip machines
- Centre NRC: ASML to collaborate with Taiwanese chip giant TSMC to upgrade its newest chip machines
- Centre Reuters: ASML to work with major chipmakers to use latest tools for larger chips - Reuters
- Centre-right The Korea Herald: Samsung, ASML deepen partnership to advance high-resolution chip tech
100% of the statements in this article were traced back to the source articles listed above.