Xiaomi Unveils Xring O3 Chip and Expands TSMC Partnership
2 sources across 2 countries · South Africa · United Kingdom
Who reported this
- Business Day
- Reuters
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- Centre
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- Right
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Xiaomi has launched the Xring O3, a new version of its in-house handset processor. According to sources, TSMC will manufacture the chip using 3-nanometre production technology. The processor is expected to power Xiaomi's upcoming flagship folding phone, with shipment targets estimated between 200,000 and 300,000 units. This move follows the launch of the Xring O1, which has seen cumulative shipments across smartphones, tablets, and watches surpass 1 million units.
Xiaomi has also contracted TSMC for two additional chips. These include the Xring O100, a 6-nm neural processing unit designed to support the MiMo large language model, and the Xring D100, a 3-nm chip intended for autonomous driving. While the O3 has entered mass production, the O100 and D100 are slated for deployment next year.
The company is pursuing deeper control over key components to strengthen its supply chain and reduce reliance on external suppliers like Qualcomm and MediaTek. This strategy comes as Xiaomi targets the premium foldable phone market, currently led by Huawei. The push occurs amid a global downturn in smartphone sales and rising component costs.
How each side framed it
- Centre
- The reporting focused on the factual announcement of the chip launch and the production partnership.
- Centre-right
- The reporting framed the move as a strategic bet to challenge competitors and reduce dependence on external suppliers during a market downturn.
Sources
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